Next Generation PECVD and Sputtering Technology
Model P is design based on Naxau SPARK® platform with patented SET® and CET® plasma technologies. SPARK® platform has a high degree of flexibility with one of industry most reliable production output. Multiple plasma technologies can be combined in one machine.
Naxau Core Etching Technology
Based on more than 20 years of continuous operation and improvements, Naxau have developed a state of arc patented plasma etching technologies SET® and CET®. A proper etching of a tool’s surface to achieve a clean and activated interface prior to coating is critical for a successful plating result. Etching needs to remove surface contaminants, such as metal oxide, water moisture, micro oil and sweats debris, etc. Etching can also reactivate a surface so the molecular linkage is open and ionic bondage is possible for the coating process.
Naxau’s SET® and CET® technologies are also used as a gas plasma source during coating. For Model M PVD coating equipment for Tools, SET® and CET® technologies can increase the hardness of a tool coating by more than 30%. For Model P PECVD coating equipment for Components, SET® and CET® technologies will further ionize inlet gas of C2H2, CH4, SiH4, etc, to achieve better crystallization and higher hardness of DLC coatings.
PECVD DLC Coating Equipment for Components
Model P | P850 | P1200 |
Plasma Zone (mm) | D680x850 | D680x1200 |
Max Loading (kg) | 1000 | 1500 |
PVD Technology | PECVD and Sputtering | PECVD and Sputtering |
Etching Technology | SET® or CET® | SET® or CET® |
Coating Available | CrN, a-C:H, a-C:Si:H, DLC, WCC, ta-C | CrN, a-C:H, a-C:Si:H, DLC, WCC, ta-C |
Dura Technology | Possible with request | Possible with request |
Number of Cathodes | 4 | 4 |
Minimum surface roughness (Ra) | Ra0.05 | Ra0.05 |
Floor Space D*W*H (mm) | 4600x2300x2200 | 4600x2300x2400 |